bonding pad
英 [ˈbɒndɪŋ pæd]
美 [ˈbɑːndɪŋ pæd]
焊盘；键合点；焊接区
双语例句
- The hooks on side B are designed to provide optimum bonding to the urethane foam pad.
在B面的吊钩是用来给乙烷泡沫衬垫提供良好的粘接作用。 - Through the silicon bonding, we achieve a wafer-level vacuum package, and the wire-bonding PAD is made after the fabrication is complete.
在完成整体结构圆片级真空封装的同时，通过引线腔结构方便地实现了中间电极的引线。 - Layer thickness analysis results from a bonding pad on a circuit board, showing nanometer resolution thickness analysis.
来自电路板结合区的厚度分析，纳米尺度的厚度分析。 - In this article, bonding pad design, stencil design and assembly process of QFN device will be introduced in detail.
文章对QFN器件的焊盘设计，网板设计及组装工艺作了详细的介绍。 - Intermetallic Compounds Formation and Reliability on Bonding Joints of Copper Wire and Gold Wire with Aluminum Alloy Pad
铜及金丝与铝合金焊盘键合的金属间化合物生长和可靠性 - The results show that the volume of solder, interstice height, and size of bonding pad have a remarkable effect on the 3-D shapes of LCCC solder joint.
结果表明，钎料体积、间隙高度、焊盘尺寸对LCCC焊点三维形态有显著的影响。 - As the demand increasing steadily for small volume 、 high density and high heat-dissipation rate IC, the key parameter of wire bonding& pad pitch has to shrink in accordance.
由于市场对小体积、高集成度和高散热率芯片的需求量与日俱增，引线键合工艺的关键参数&焊盘间距也不断缩小以满足市场要求。 - Damage of Bonding Force on IC Aluminum Pad in COF Structure
COF结构中键合力损伤芯片Al层的研究 - The ultrasonic bonds, after bonding and aging, of Au wire bonded on the Al metallization pad were analyzed by Scanning Electronic Microscopy ( SEM) with Energy Dispersive X-Ray Spectrometer ( EDX).
本文采用电子扫描电镜（SEM）及X射线能谱（EDX）分析了Au丝与Al金属化层焊盘键合后在老化过程中界面处元素的分布规律以及化合物的演变过程。 - This technology can be widely used for chip encapsulation in the field of micro-electronics. The core of this technology is that it achieves a vision machine to automatically recognize and locate the bonding pad on the unencapsulated semiconductor chip.
这一技术可以广泛应用于微电子行业中的芯片封装技术，它的核心是实现了对未封装的半导体芯片上的焊盘进行识别并定位的视觉机器。 - The circuit is simulated with models of bonding wire, pad and ESD circuits.
在混频器的设计与仿真过程中，同时考虑到了压焊线、焊盘、ESD电路的影响。 - A main character in ultrasonic wire bonding is the welding formation in the contact area. The character shows that the welding area locates only at the periphery of the contact area, although the contact area between the wire and pad is much larger.
在超声波线焊中，虽然金线和焊接平台间的接触界面较大，但实验显示，焊接部位只发生在接触截面的周边，这是一种特别的焊接界面形态和超声波线焊的机理。 - Roller contour of bonding pad roll for SSAW pipe unit has a sensitive effect on welded pipe forming and welding quality, improper roller contour may result the occurence of defects such as offset and crack of inside-welding.
螺旋焊管机组焊垫辊的辊面形状对焊管成型、焊接质量有较大的影响，不当的辊面形状有可能产生错边、内焊裂纹等缺陷。 - This paper introduces how to recognize and locate the bonding pad from a silicon chip image with the method of Digital Image Processing and Pattern Recognition.
介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。 - The influence of junction area and bonding pad size on the dark current has been also analyzed.
文中还对器件结面积和电极尺寸等对暗电流的影响进行了比较和分析。 - New Type Roller Contour of Bonding Pad Roll for SSAW Pipe Unit
新型螺旋焊管机组焊垫辊辊型 - The hardness distributing near bonding pad and strength of interface have been studied. The interface structure and bonding mechanism of electromagnetic hemicontinuous double pouring casting roll have been analyzed.
研究了结合界面附近的硬度分布和界面的结合强度，并分析了电磁半连续复合铸造轧辊的界面结构和结合机理。 - This phenomenon indicates that the strength of the IMC layers which connect the BGA and bonding pad is increased by adding nanoparticles.
这说明了钎料与焊盘连接处的IMC的强度在添加纳米颗粒后得到了明显的提高。